KLC LTCC Multilayer Substrates

Features

• Suitable for bare chip mounting as it has thermal expansion coefficient close to that of silicon and excellent dimensional accuracy and flatness.
• Excellent high frequency characteristics are achieved by the low-loss dielectric ceramic and the low-loss conductor.
• Downsizing and high integration density can be achieved by the multilayer wiring, the multicavity structure and the surface/buried resistor printing.
• The substrate and the cavity can be formed in round, polygonal, concave or convex shape.
• Thermal vias can be placed in the bare chip mounting area to improve the thermal conductivity of the substrate.
• The use of ceramic material contribute to the excellent heat and humidity resistance and prevents outgas and dust generation.
• Products meet EU RoHS requirements